Electronics Failure Analysis Case Study

This Electronics Failure Analysis Case Study highlights how ITRI Innovation (a leading electronics testing laboratory) helped a leading assembler of electronics components for the automotive sector.
The failure of a chip component was found to be caused by the encapsulation process. The case study explains the process that enabled this conclusion to be reached and the recommendations that were made to improve long term reliability. Feel free to call +44 1727 871328 to discuss your electronics failure analysis requirements.

Electronics Failure Analysis Case Study:

Electronics Failure Analysis Case Study from ITRI Innovation from ITRIInnovation

 

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